The OCP APAC Summit 2026 opened August 11 at TaiNEX2 Taipei with 8,000sqm and 145 exhibitors, gathering global cloud providers, semiconductor companies and system manufacturers focusing on next-gen hyperscale data centers.
TSMC VP of Advanced Packaging He Junhui introduced that TSMC's 5.5x reticle CoWoS advanced packaging is in mass production with yield exceeding 98%, reaching 99% for some customers. TSMC expects to expand to 14x+ reticle size by 2029, integrating about 10 large compute chips and 20 HBM stacks.
Nvidia, Lightmatter and Ayar Labs also shared advances in AI factory architecture and co-packaged optics (CPO).